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ceramic substrate
Good thermal conductivity
Lower thermal expansion coefficient
High pull out strength
High voltage resistance;
Ceramics with metalizing, plating and brazing, which is one type of ceramics joining or the application of a thin coating of metal to ceramic materials. It has excellent properties of electrical insulation, low electrical loss, high purity, hermetic sealing.
Substrate Material: Al2O3 95%
Dielectric Strength: 8.3 KV/ mm
Compressive Strength: 2100 MPa
Max. Use Temperature: 1700 C
JOINING TYPE
Ceramic + Mo/Mn metallization + plating Ni + brazing Ag (Vacuum brazing and brazing under controlled atmospheres)
APPLICATIONS
It is used as high voltage vacuum switch, electrical networks, silicon-controlled rectifier parts, potentiometer circuit substrate, refrigerating unit circuit substrate, integrated circuit substrate, electric circuit substrate, which are widely adopted in the fields of electric power, electronics, metallurgy, machinery, astronautics, aviation, military etc.
Features
High pull out strength
Excellent Electrical Insulation
Thermal Conductive Properties
Lower Thermal Expansion Coefficient
High temperature resistance
High voltage resistance
Custom manufacture available;
ceramic substrate;